Electronic Component Engineer

Requisition ID: 21541 

Group 72—Fabrication Engineering
The Fabrication Engineering Group provides fabrication engineering and materials management for both mechanical and electronic projects using state-of-the-art technology. The group is involved from the initial design and material sourcing through manufacturing, assembly, integration, and test, and works with program teams to influence schedule and budget. The group continually investigates innovative fabrication technologies to assess their utility for Laboratory efforts. Facilities include a machine shop with a wide range of computer-aided machine tools, plus sheet metal, polymer, and mechanical inspection facilities. Recent equipment investments in 5-axis milling, 3D printing, and diamond turning are now on line. In the electronics area, capabilities include circuit-board design, assembly, inspection, and failure analysis. The group also supports the Laboratory's environmental test requirements with vibration shakers, thermal chambers, vacuum chambers, and clean rooms.

 

Position Overview

Looking to hire a lead electronic component engineer to work as a member of program teams developing the devices described above.  As lead, this person will be a Laboratory subject matter expert (SME) on the topics of component engineering, and component quality and reliability.  This person will also provide direction to less senior component engineers in the assessment of fitness for mission of electronic components selected for use in spacecraft payloads and other high reliability applications.

 

Specific Responsibilities

  • Be the subject matter expert on advanced component technologies, such as radiation effects/mitigations, outgassing, upscreening, chip packaging, tin whiskering/mitigations, crystal/oscillator reliability, component screening and stress testing etc.
  • Support parts selection during development; recommend alternatives if selected parts are not suitable or are unavailable.
  • Research manufacturers’ specifications to assess part fitness for the application.
  • Identify parts that are over- or under-specified, and recommend action, such as substitution or upscreening.
  • Interface directly with original component manufacturer (OCM), as required, to determine suitability or later during failure analysis.
  • Determine if parts require special modification, test, or handling for use.Examples include:mechanical modifications, such as lead forming; plating alloy mitigations, such as for pure tin or pure gold plated leads; fragility mitigations, if any, such as special handling or storage requirements; moisture or temperature sensitivities, requiring non-standard processes during assembly; Identification of floating metal, requiring draining of charge to ground in the design; etc.
  • When required, participate in source inspections such as pre-cap inspections of parts.

 

Qualifications

  • MS Electrical Engineering preferred, with 5 years’ experience in this specific field. In lieu of an MS, will consider BSEE with 8 years’ experience in the field.
  • Strong working knowledge of appropriate component standards, such as NASA, MIL, and others
  • Working knowledge of components’ requirements for space applications
  • Experience in use of GIDEP alerts and advisories
  • Skill in Microsoft Office suite
  • Strong oral and written communication skills

MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.

Company
MIT Lincoln Laboratory
Posted
03/25/2018
Type
Full time
Location
Massachusetts, US