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Package Simulation Engineer - Advanced Packaging Technology Development


Req. ID: 123066 

Micron Technology’s vision is to transform how the world uses information to enrich life and our commitment to people, innovation, tenacity, collaboration, and customer focus allows us to fulfill our mission to be a global leader in memory and storage solutions. This means conducting business with integrity, accountability, and professionalism while supporting our global community.


As a Package Simulation Engineer at Micron Technology, Inc. you will work in the Advanced Package Technology development group on mechanical and thermal simulations. In this position, you will be responsible for influencing mechanical and thermal package designs and finding optimal process conditions for FAB and assembly to mitigate wafer/package level warpage and CPI stress. Scope of your work is to address all mechanical and thermal aspects of 3DI and new packaging technology that is associated with material and process interactions. 3DI package development such as next generation DDR and/or HBM will be the main target product on your work. Candidate will be mainly responsible for the modeling but also characterization of mechanical and thermal response of the IC package using analysis and measurement techniques. This position will interface with package design, assembly/process integration, characterization, and other process module teams.    



  • Provide mechanical and thermal simulation reports to support pathfinding efforts and technology development
  • Guide test vehicle development to improve simulation correlation to empirical data
  • Provide material, structure and assembly process condition recommendations for successful package development


Successful candidates must have:

  • Solid knowledge through academic coursework or experience required in mechanical and thermal multi-physics modeling and measurements of IC packaging and related areas.
  • A strong background in mechanical and thermal sciences with emphasis on both analytical and measurement methods.
  • Thorough knowledge of material properties and material property test methods (non-linear deformation, viscous behavior, etc).
  • A good understanding of semiconductor packaging processes
  • Working knowledge/experiences in applying Finite Element Modeling (FEM) in related areas; and familiarity with software tools such as ANSYS (APDL), FloTHERM, and IcePak.  
  • A good understanding of semiconductor packaging technology and trends such as 2.5D and FOP package, etc. 
  • Strong oral and written communication skills.
  • Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.
  • Proactive and creative approach for problem solving.


Degree required:

  • MS but PhD preferred


Academic Discipline(s):

  • Mechanical Engineering, Materials Engineering or related discipline


Experience Required:

  • PhD with emphasis on numerical simulations of materials and structures
  • And/or IC packaging industry experience over 5 years


About Us


As the leader in innovative memory solutions, Micron is helping the world make sense of data by delivering technology that is transforming how the world uses information. Through our global brands — Micron, Crucial and Ballistix — we offer the industry’s broadest portfolio. We are the only company manufacturing today’s major memory and storage technologies: DRAM, NAND, NOR and 3D XPoint™ memory. Our solutions are purpose built to leverage the value of data to unlock financial insights, accelerate scientific breakthroughs and enhance communication around the world.


Micron Benefits


Employee Rewards Program, Healthcare, Paid time off (Combined Sick and Vacation Time), Retirement savings plans, Paid maternity/paternity leave, Employee Assistance Program, Professional development training, Workplace wellness programs, Micron Health Clinic (Boise only), Fitness Center / Activity rooms (Boise only), Tuition Reimbursement, Micron Corporate Discounts, Casual Dress attire.

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords:  Boise || Idaho (US-ID) || United States (US) || Technology Development || Experienced || Regular || Engineering || Not Applicable ||

Full time
Boise, ID 83701, US