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Sr Specialist, Advanced Electronics Packaging Development Engineer L3Harris Technologies Job Title: Sr Specialist, Advanced Electronics Packaging Development Engineer
Job Code: 9331
Job Location: Palm Bay, FL
Job Description:
The L3Harris Microelectronics organization is growing our advanced packaging research and development efforts and capabilities. This role will allow you to pursue and then lead new business opportunities in Microelectronics related to advanced packaging including 2.5D and 3D Integration, high density build up, photonic integrated circuits, thermal management, and failure analysis. Your primary responsibilities will require basic understanding of government business acquisition models and deep understanding of challenges associated with low SWAP architecture and miniaturized electronic systems. The role will place you within a multidisciplinary team of scientists and engineers to deliver vital contributions to mission critical microelectronics solutions that help protect the U.S.A and our allies.
Essential Functions:
Work with Chief Engineers and subject matter experts (SMEs) to support opportunity development, shaping, pursuit, capture, winning, and then executions of advanced packaging and microelectronics business. Develop proposals, statements of work, project plans, resource estimates, and material needs. Promote emergent state-of-the-art practices Lead new programs and projects in Microelectronics. Ability to document, communicate, and present technical topics/recommendations/issues/concerns to internal and external customers.
Qualifications:
Bachelor’s Degree in Electrical, Mechanical, Materials Science Engineering, Physics, or related field and minimum 6 years of prior relevant experience. Graduate Degree and a minimum of 4 years of prior related experience. In lieu of a degree, minimum of 10 years of prior related professional experience. Ability to obtain US government Security Clearance Experience with advanced microelectronic packaging including: 3D die stacking and associated thermal, mechanical, and assembly issues Through Silicon Vias (TSVs) MEMS and wafer bonding Failure analysis of 3D die stacks
Preferred Additional Skills:
Active security clearance Silicon-level design and experience with design tools such as Tanner L-Edit, Cadence APD and Virtuoso Experience with government programs and acquisition
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As a proud Equal Opportunity Employer (EOE), we do not discriminate based on race, color, national origin, ancestry, citizenship status, religion, sex, sexual stereotyping, sexual orientation, gender, gender identity, gender expression, age, marital status, mental or physical disability, medical condition, genetic information, military or veteran status, pregnancy (which includes pregnancy, childbirth, and medical conditions related to pregnancy, childbirth, or breastfeeding), or any other protected characteristic. Employment may be contingent upon ALDI's receipt of an acceptable and job-related drug test, motor vehicle report, and/or reference check, as applicable and permissible by law. Green Acres, FL, US, 33463Posted 3 hours ago RN- Hematology/Oncology (Full Time, Day shift) Nicklaus Children's Hospital Responsible for the planning and delivery of care utilizing nursing processes: assessment, implementation and evaluation. Oversees the plan of care, utilizes effective problem solving strategies and applies evidence based practice. Supports and upholds quality standards of a Magnet designated hospital and Patient Bill of Rights. Practices under the supervision of the Nursing Manager/Director and has passion for learning. Provides compassionate and family centered care Hematology/Oncology for patients. Miami, FL, US, 33135Posted 3 hours ago CNA - Certified Nursing Assistant. Boynton Beach Rehab Center * Clear and active Certified Nursing Assistant (CNA) licensure in the state of practice required. *ABOUT US* *BOYNTON BEACH REHABILITATION CENTER*, located at 9600 Lawrence Road, Boynton Beach, FL 168 bed skilled nursing center that offers in-patient residential care, short-term rehabilitation and specialty services. Our property features private and semi-private rooms, landscaped grounds, 7-day per week admissions, and rehabilitation gym with 7 day per week therapy, and we accept a wide variety of insurance plans. We manage situations to create positive outcomes. To learn more, please visit * today!* Our Service Standards: * Sincere Appreciation…for everyone * Hearing Needs…and responding quickly. * Caring Approach…in everything we do * Managing Situations…for positive outcomes Job Types: Full-time, Part-time Pay: $16.00 - $18.75 per hour Expected hours: 40 per week Benefits: * 401(k) * Dental insurance * Flexible schedule * Health insurance * Life insurance * Paid orientation * Paid time off * Tuition reimbursement * Vision insurance Physical setting: * Long term care * Nursing home * Rehabilitation center Standard shift: * Day shift * Evening shift * Night shift Supplemental pay types: * Bonus opportunities Supplemental schedule: * Holidays Weekly schedule: * Every weekend * Rotating weekends * Weekends as needed Experience: * Caregiving: 2 years (Required) License/Certification: * CPR Certification (Preferred) Ability to Relocate: * Boynton Beach, FL 33436: Relocate before starting work (Required) Work Location: In person %5547499% %%mednurse%% Boynton Beach, FL, US, 33436Posted 3 hours ago 1st Shift Warehouse Team Member. 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Job Title: Sr Specialist, Advanced Electronics Packaging Development Engineer
Job Code: 9331
Job Location: Palm Bay, FL
Job Description:
The L3Harris Microelectronics organization is growing our advanced packaging research and development efforts and capabilities. This role will allow you to pursue and then lead new business opportunities in Microelectronics related to advanced packaging including 2.5D and 3D Integration, high density build up, photonic integrated circuits, thermal management, and failure analysis. Your primary responsibilities will require basic understanding of government business acquisition models and deep understanding of challenges associated with low SWAP architecture and miniaturized electronic systems. The role will place you within a multidisciplinary team of scientists and engineers to deliver vital contributions to mission critical microelectronics solutions that help protect the U.S.A and our allies.
Essential Functions:
Work with Chief Engineers and subject matter experts (SMEs) to support opportunity development, shaping, pursuit, capture, winning, and then executions of advanced packaging and microelectronics business. Develop proposals, statements of work, project plans, resource estimates, and material needs. Promote emergent state-of-the-art practices Lead new programs and projects in Microelectronics. Ability to document, communicate, and present technical topics/recommendations/issues/concerns to internal and external customers.
Qualifications:
Bachelor’s Degree in Electrical, Mechanical, Materials Science Engineering, Physics, or related field and minimum 6 years of prior relevant experience. Graduate Degree and a minimum of 4 years of prior related experience. In lieu of a degree, minimum of 10 years of prior related professional experience. Ability to obtain US government Security Clearance Experience with advanced microelectronic packaging including: 3D die stacking and associated thermal, mechanical, and assembly issues Through Silicon Vias (TSVs) MEMS and wafer bonding Failure analysis of 3D die stacks
Preferred Additional Skills:
Active security clearance Silicon-level design and experience with design tools such as Tanner L-Edit, Cadence APD and Virtuoso Experience with government programs and acquisition
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