The successful candidate would be the lead / single point of contact for any and all matters specific to accounts assigned. This includes meeting sales targets, negotiating with the customer, understanding customer needs and picking up new projects, customer service & liaising with the factory for smooth operations and better margins in both sites of Ipoh & Suzhou, China.
Expand the relationships with existing customers by continuously proposing solutions that meet their objectives to achieve your yearly sales targets;
Overseeing customer account management and agreements to maximize profit;
To review forecast and maintain a high true factor while dealing with the right mix on a weekly basis between the different BU;
To deal with customers on buy-back where stocks are not consumed and also review the details of slow moving stocks to prevent expiry;
To deal with compensation and claims along with negotiating contracts;
To provide efficient and effective sales service support to customers consistently;
Serve as the link of communication between key customers and internal teams;
Resolve any issues and problems faced by customers and deal with complaints to maintain trust;
Prepare regular reports of progress and forecasts to internal and external stakeholders using key account metrics;
Responsible for budget implementation and involve in ROI analysis to determine the impact of the sales activities and events; and
Leading and coaching the sales support team supporting their key account in managing the dedicated accounts assigned to them.
Strong communication and interpersonal skills with aptitude in building relationships with professionals of all organizational levels;
Ability in problem-solving and negotiation;
Experience in providing solutions based on customer needs; and
Highly result driven, growth mindset, resilience with can – do attitude.
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world. Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business. We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur. The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Additional Company Information
More than 5000 Employees
Average Processing Time
Manufacturing / Production
Benefits & Others
Dental, Education support, Miscellaneous allowance, Medical, Parking, Regular hours, Mondays - Fridays, Business (e.g. Shirts), Medical for immediate family members, car subsidy & home loan (for Executives)