RF Packaging Engineer

RF Packaging Engineer

Cree | Ipoh, 08, MY

Posted a month ago

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Description


Responsibilities:

Design and develop new mechanical and thermal model structure for new products to meet customer requirements, manufacturability & in-house assembly parts.
Work closely with design team for thermal & mechanical design solution & establishing thermal specification, define thermal design methodologies, analysis and testing requirements based on customer requirements.
Involved in mechanical & thermal simulation & provide conceptual preliminary/detailed design; materials selection, and manufacturing method for new product developments and continuous improvement of existing products.
Create and maintain Bills of Material; create high quality and assembly drawings; prepare assembly guidelines and requirements
Ensuring products achieve quality, feature set, cost, schedule, reliability, mechanical and regulatory/safety goals. Support project deliverables are completed in a timely manner

Requirements:

BS, MS and PhD preferably in Mechanical/Mechatronics Engineering or Thermal Engineering Material Engineering, Material Science, Applied Science, or other relevant qualification.
Strong knowledge of fluid dynamics and heat transfer fundamentals, preferably thermal management background with 3 or more years relevant working experience. Preferred in semiconductor field.
Experience in Thermal and Mechanical Design & Analysis: Proficiency in Solidworks & Ansys & AutoCAD.
Strong computational modeling and simulation experience with working knowledge of basic engineering calculations and principles
Strong background in statistical analysis and proficient in the use of statistical analysis software packages such as JMP
Prepare concept designs of mechanical sub-system that meets customer requirements and expectations, reliability and robustness requirements, manufacturing processes and safety guidelines.
Independent, self-motivated, keen learner and ability to work independently as well as in cross-functional teams
Solid experience and technical understanding in semiconductor reliability standards and test methods
Experience in materials characterization and analysis, DOE, reliability standards, and FA technique is preferred
Experience in low, medium and high-volume manufacturing for high RF Power Products is preferred
Good communication, Interpersonal and Leadership skills.