R&D Group - Patterning Solutions Technologist


As a Senior Technologist in the Technology Development Group at Micron, you will work in industry-leading 300mm R&D facility on technology which enables future memory scaling. You will be responsible for developing next generation innovative patterning solutions to close critical technology gaps. You will take ideas from conception through process/module development and implementation. This position requires creative problem-solving skills focused on devising and optimizing process flows which enable future patterning solutions.  You will engage with numerous cross-functional teams including Process Development, Process Integration, Equipment Engineers etc. to focus and accelerate development of technology that will most likely lead to a commercially successful high-density memory chips.



  • Lead technical investigations and module development including cost/complexity assessments to meet performance metrics for advanced patterning solutions
  • Coordinate experimental design and analysis of candidate process sequences and materials/methods
  • Lead and coordinate project activities across cross-functional teams
  • To develop new methods of creating and transferring patterns on to wafers
  • Analyze defect patterns on wafers and establish correlations with patterning and other related issues.
  • Organize well designed experiments to understand the interaction between process and hardware parameters and use this knowledge to optimize for best performance
  • Work with various integration/structural constraints to enable a functional device
  • Derive insightful inferences from the analysis of physical and electrical data and utilize the understanding to modify processes to meet the project requirements
  • Design and manage experiments run in the R&D Fab and with equipment vendors



Required Skills:  

  • Success in our multi-tasking team environment requires excellent communication, organizational, and team building skills.
  • Proficient experience with Process Integration and module development is a plus.
  • Working level understanding of dry etch, photo, and deposition processes.
  • In-depth understanding of plasma physics, etch processes and plasma processing equipment.
  • Ability to research and stay abreast with the published literature in patterning technologies.
  • Proficiency with data analysis, DOE, and statistical techniques is assumed.
  • Be a critical thinker and at the same time be a team player and handle constructive criticism from other team members and leverage input to drive projects forward.
  • Familiarity with metro and RDA techniques to characterize structure performance.
  • Experience and/or knowledge in advanced patterning techniques such as 193nm Lithography, EUV, self-assembly, imprint techniques etc. a plus.
  • Possess a high degree of self-motivation, goal orientation and the ability to aggressively focus on solving problems and to learn new skills.
  • Possess ability to plan and execute well-designed experiments and report results in clear concise reports.
  • Demonstrate dependability and willingness to take on responsibilities.
  • Ability to work on multiple projects and work through cross-disciplinary and cross-organizational logistical issues.
  • Proactive approach to problem/project management and good problem-solving skills
  • Strong teamwork skills.



MS or PhD in Materials Science, Electrical Engineering, Chemistry, Physics, or other related technical field is required.

5+ years of Process Development and/or Process Integration desirable

Experience in Dry etch and/or Photo is a plus.  Other background may be considered in light of experience specific to this job.

  • Knowledge in one or more of the following areas:
    • Transport phenomena
    • Plasma
    • Atomic/Molecular Physics
    • Surface Phenomena
    • Reaction Engineering


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices. Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters. To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748). Keywords: Boise || Idaho (US-ID) || United States (US) || Technology Development || Experienced || Regular || Engineering || #LI-MT1 ||


Full time
Boise, ID 83701, US