3DXP Technical Product Lead


 

Req. ID: 123188 

As an 3DxP Technical Product Lead at Micron Technology PE group, your primary responsibility will be driving product development activities including product definition, scope, schedule and supply/demand needs. You will be driving multiple projects and teams to innovate and solve complex problems for 3DxP product development, and execute and coordinate effective actions to enable the projects to hit key milestones, timelines and requirements.

 

Responsibilities and Tasks

  • Coordinate cross-functional teams for successful execution of program priorities.
  • Drive and manage product requirement, scope and schedule as well as product supply and demand for various product needs.
  • Define sub-milestones for projects and work with the team to achieve the targets and timelines.
  • Provide regular reporting on program status, schedule changes, high-priority issues, and manufacturing yields throughout the life of the product.
  • Coordinate resolution of product issues, driving root cause and corrective action.
  • Ensure alignment between critical program milestones and the manufacturing capabilities and test flows necessary for high-volume manufacturing.
  • Participate in design reviews and FMEA’s to ensure manufacturing/test features and functionality to optimize high-volume manufacturing.
  • Analyze, and interpret data from high volume manufacturing and characterization with respect to program requirements.
  • Work closely with business unit and customer teams to meet product delivery dates, and resolve customer integration issues and technical requests.
  • Actively participate and engage in product engineering meetings and focus teams.

Skills:

  • Extensive knowledge of Memory and Storage System behavior, architecture and design
  • Excellent organizational, communication, presentation and leadership skills
  • Excellent data analysis, problem solving, and decision-making skills
  • Excellent Project Management skills.
  • Ability to work independently in a very fast paced environment and adapt to change
  • Drive to determine root-cause and provide corrective action for product issues
  • Ability to lead cross functional teams to understand and fix a wide variety of issues
  • Attention to detail, organizational skills and the ability to balance multiple projects
  • Self-motivated and enthusiastic in a challenging, dynamic environment
  • Demonstrated ability to partner successfully with other groups to build strong peer relationships and achieve the best outcomes for Micron.
  • Familiarity with problem solving methodologies such as 8D and 5Why is preferred.
  • Experience with semiconductor fabrication, backend manufacturing processes, and SPC is preferred.
  • JMP, Python, Perl, Linux, Excel, PowerPoint, MS Project, SPC, FMEA is a plus

Education:

Bachelor's or Masters Degree in Electrical/Electronics Engineering

Experience:

7+ years’ experience in semiconductor product development.

 


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Boise || Idaho (US-ID) || United States (US) || NVE (Non-Volatile Engineering Group) || College || Regular || Engineering || #LI-LA1 ||
 

Company
Micron
Posted
09/20/2018
Type
Full time
Location
Boise, ID 83701, US