Compound-Semiconductor Fabrication Process Engineer


Group 89—Quantum Information and Integrated Nanosystems Group
The Quantum Information and Integrated Nanosystems Group conducts quantum information science research from a shared foundation of innovative control-signal design, outstanding fabrication tools, and well-equipped measurement infrastructure. The group has a broad range of experimental and prototyping activities. The group's quantum information science activities include the development of superconducting and trapped-ion qubits and quantum sensing with nitrogen-vacancy (NV) centers in diamond. In addition, the group has robust capabilities in classical superconducting circuits, complementary metal-oxide semiconductor (CMOS) design and fabrication, and integrated photonics. These component technologies are used in synergy with quantum information science demonstrations, as well as in standalone applications that include beyond-CMOS circuit technologies, energy-starved sensors, compact optical communication and laser radar transceivers, and microwave photonic signal processing.

 

The Quantum Information and Integrated Nanosystems Group is seeking a fabrication process engineer with experience in the fabrication, packaging, and characterization of compound-semiconductor optoelectronic components and photonic integrated circuits (PICs).  Material systems under development include InP, GaAs, GaN, and their associated ternary and quaternary compositions. Example components include high-power diode lasers and optical amplifiers, single-photon emitters, high-current waveguide photodiodes, wideband optical modulators, and arrays of these components.  PICs will be realized using both monolithic and hybrid integration techniques.  The candidate will work closely with other Staff to develop advanced components, circuits, and subsystems, and to apply them to solve problems in the national interest.

 

Requirements:

  • BS or MS degree in Electrical Engineering, Chemical Engineering, Materials Science and Engineering, Physics, Chemistry or related field with 2 or more years’ experience in the fabrication of compound-semiconductor-based devices or integrated circuits. 
  • Must have hands-on experience with multiple compound-semiconductor fabrication processes (e.g., lithography, wet etching, reactive-ion etching, sputtering and e-beam deposition of metal and dielectric materials, wafer and device cleaving). 
  • Must exhibit a detailed understanding of the interplay between material properties, fabrication processes, and device performance. 
  • Knowledge of chemistry, electrical and optical characterization techniques, packaging techniques, and epitaxial material growth is desirable.
  • Experience in both research laboratory and industrial production environments is also desirable. 
  • Candidate must have excellent documentation and communication skills, and be able to work both independently and in a dynamic multi-disciplined team environment.


MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.

Company
MIT Lincoln Laboratory
Posted
09/18/2018
Type
Full time
Location
MA, US